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DATA SHEET DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC2756TB
MIXER+OSCILLATOR SILICON MMIC FOR FREQUENCY DOWNCONVERTER OF L BAND WIRELESS RECEIVER
DESCRIPTION
The PC2756TB is a silicon monolithic integrated circuit designed as L band frequency downconverter for receiver stage of wireless systems. The IC consists of mixer and local oscillator. The TB suffix IC which is smaller package than conventional T suffix IC contributes to reduce your system size. The PC2756TB is manufactured using NEC's 20GHz fT NESATTM III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
* Wideband operation * High-density surface mounting * Low current consumption * Supply voltage * Suppressed spurious signals * Equable output impedance : fRFin = 0.1 GHz to 2.0 GHz, fIFout = 10 MHz to 300 MHz : 6-pin super mini mold package : ICC = 6.0 mA TYP. @ VCC = 3.0 V : VCC = 2.7 to 3.3 V : Due to double balanced mixer : Single-end push-pull IF amplifier
* Equable temperature-drift oscillator : Differential amplifier type oscillator
APPLICATIONS
* Data carrier up to 2.0 GHz MAX. * Wireless LAN up to 2.0 GHz MAX.
ORDERING INFORMATION
Part Number Marking Package Supplying Form
PC2756TB-E3
C1W
6-pin super minimold
Embossed tape 8mm wide. Pin1, 2, 3 face to tape perforation side. QTY 3kp/reel.
Remark
To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC2756TB)
Caution Electro-static sensitive devices.
The information in this document is subject to change without notice.
Document No. P12807EJ2V0DS00 (2nd edition) Date Published February 1999 N CP(K) Printed in Japan
The mark
shows major revised points
(c)
1997
PC2756TB
PIN CONNECTIONS
(Top View) (Bottom View)
Pin No. 1 Pin Name RFin GND LO1 LO2 VCC IFout
C1W
3 2 1
4 5 6
4 5 6
3 2 1
2 3 4 5 6
PRODUCT LINE-UP (TA = +25 C, VCC = 3.0 V, ZL = ZS = 50 )
Items Part Number VCC (V) 2.7 to 3.3 ICC (mA) 6.0 900 MHz 1.6 GHz 900 MHz 1.6 GHz CG CG NF NF (dB) (dB) (dB) (dB) 14 14 10 13 fRFin (GHz) fIFout (GHz) fOSC Package (GHz) to 2.2 6-pin minimold 6-pin super minimold
PC2756T PC2756TB
0.1 to 2.0 10 to 300
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. INTERNAL BLOCK DIAGRAM
Mixer IF amplifier
RF input Oscillator
IF output
Note Oscillator tank circuit must be externally attached to LO1 and LO2 pins.
LO1LO2 VCC GND
2
Data Sheet P12807EJ2V0DS00
PC2756TB
PC2756TB LOCATION EXAMPLE IN THE SYSTEM
RX BPF
PC2756TB
BPF 1st MIXER
PC2745TB
PLL frequency synthesizer LPF VT
Reference osillator
This document is to be specified for PC2756TB. For the other part number mentioned in this document, please refer to the data sheet of each part number.
Data Sheet P12807EJ2V0DS00
3
PC2756TB
PIN EXPLANATION
Pin No. 1 Applied Voltage V - Pin Voltage Note V 1.2
Symbol
Assignment
Function and Application
Equivalent Circuit
RFin
RF input
This pin is RF input for mixer designed as double balance type. This circuit contributes to suppress spurious signal with minimum LO and bias power consumption. Also this symmetrical circuit can keep specified performance insensitive to process-condition distribution. This pin must be externally coupled to front stage with capacitor for DC cut. Must be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. (Track length should be kept as short as possible.) These pins are both base-collector of oscillator. This oscillator is designed as differential amplifier type. 3 pin and 4 pin should be externally equipped with tank resonator circuit in order to oscillate with feedback loop. Also this symmetrical circuit can keep specified performance insensitive to process-condition distribution. Each pin must be externally coupled to tank circuit with capacitor for DC cut. Supply voltage 3.0 0.3 V for operation. Must be connected bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. This pin is output from IF buffer amplifier designed as single-ended push-pull type. This pin is assigned for emitter follower output with low-impedance. This pin must be externally coupled to next stage with capacitor for DC cut.
VCC
VCC
1
2
GND
Ground
0
-
3
LO1
Local oscillator base collector
-
1.2
VCC
4
LO2
Local oscillator base collector
-
1.2
3
4
5
VCC
Power supply
2.7 to 3.3
-
6
IF out
IF output
-
1.7
6
Note Pin voltage is measured at VCC = 3.0 V APPLICATION This IC is guaranteed on the test circuit constructed with 50 equipment and transmission line. This IC, however, does not have 50 input/output impedance, but electrical characteristics such as conversion gain and intermodulation distortion are described herein on these conditions without impedance matching. So, you should understand that conversion gain and intermodulation distortion at input level will vary when you improve VS of RF input with external circuit (50 termination or impedance matching). External circuits of the IC are explained in a following application note. * To RF and IF port : Application Note "Usage and Application Characteristics of PC2757T, PC2758T and PC8112T, 3-V Power Supply, 1.9-GHz Frequency Down Converter ICs for Cellular/Cordless Telephone and Portable Wireless Communication" (Document No. P11997E)
4
Data Sheet P12807EJ2V0DS00
PC2756TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Power Dissipation Symbol VCC PD TA = +25 C Mounted on double sided copper clad 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85 C) Conditions Rating 5.5 200 Unit V mW
Operating Ambient Temperature Storage Temperature
TA Tstg
-40 to +85 -55 to +150
C C
RECOMMENDED OPERATING RANGE
Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 2.7 -40 TYP. 3.0 +25 MAX. 3.3 +85 Unit V C
ELECTRICAL CHARACTERISTICS (TA = +25 C, VCC = 3.0 V, ZL = ZS = 50 , Test circuit)
Parameter Circuit Current RF Frequency Response Symbol ICC fRFin Conditions No input signals CG (CG1 -3 dB) fIFout = 150 MHz constant CG (CG1 -3 dB) fRFin = 0.9 GHz constant fRFin = 0.9 GHz, fIFout = 150 MHz PRFin = -40 dBm fRFin = 1.6 GHz, fIFout = 20 MHz PRFin = -40 dBm fRFin = 0.9 GHz, fIFout = 150 MHz fRFin = 1.6 GHz, fIFout = 20 MHz fRFin = 0.9 GHz, fIFout = 150 MHz PRFin = -10 dBm fRFin = 1.6 GHz, fIFout = 20 MHz PRFin = -10 dBm MIN. 3.5 0.1 TYP. 6.0 - MAX. 8.0 2.0 Unit mA GHz
IF Frequency Response
fIFout
10
-
300
MHz
Conversion Gain 1
CG1
11
14
17
dB
Conversion Gain 2
CG2
11
14
17
dB
Single Sideband Noise Figure 1 Single Sideband Noise Figure 2 Maximum IF Output Level 1
NF1 NF2 PO (SAT) 1
- - -11
10 13 -8
13 16 -
dB dB dBm
Maximum IF Output Level 2
PO (SAT) 2
-15
-12
-
dBm
STANDARD CHARACTERISTICS FOR REFERENCE (Unless otherwise specified, TA = +25 C, VCC = 3.0 V, ZL = ZS = 50 )
Parameter Output 3rd Order Intercept Point Phase Noise LO Leakage at RF Pin LO Leakage at IF Pin Maximum Oscillating Frequency Symbol OIP3 PN LOrf LOif fOSCMAX. Conditions fRFin = 0.8 to 2.0 GHz, fIFout = 0.1 GHz, Cross point IP. fOSC = 1.9 GHz
Note
Reference +4.0 -68 -35 -23
Note
Unit dBm dBc/Hz dB dB GHz
fLOin = 0.8 to 2.0 GHz fLOin = 0.8 to 2.0 GHz VaractorDi: 1SV210, L: 7 nH
2.2
Note On application circuit example.
Data Sheet P12807EJ2V0DS00
5
PC2756TB
SCHEMATIC SUPPLEMENT FOR RF, IF SPECIFICATIONS
RF Frequency Response fIF = 150 MHz PRFin = - 40 dBm
MIN. CG1 11 8
TYP. 14 11
MAX. 17 14
Unit dB dB
Conversion Gain CG (dB)
CG1-3 dB
CG1 CG1-3 dB Guaranteed gain level
0.1
0.9 RF Frequency fRF (GHz)
2.0
IF Frequency Response fRF = 0.9 GHz PRFin = - 40 dBm
Conversion Gain CG (dB)
CG1 CG1-3 dB Guaranteed gain level
10
150 IF Frequency fIF (GHz)
300
6
Data Sheet P12807EJ2V0DS00
PC2756TB
TEST CIRCUIT
(Top View) Signal Generator 1 000 pF C2 1 000 pF 3 LO1 LO2 4 C3 3 300 pF C4 1 C1 RFin IFout 6 3 300 pF C5 3V 50
2 Signal Generator 1 000 pF 50
GND
VCC
5
50 Spectram Analyzer
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
LO1
C3
LO2
GND
C
2
VCC
C4
RF input
C1
C5
IF output
COMPONENT LIST No. C1 to C3 C4, C5 Value 1 000 pF 3 300 pF
Notes (1) 35 x 42 x 0.4 mm double copper clad polyimide board. (2) Back side: GND pattern (3) Solder plated on pattern (4) (5) : Through holes pattern should be removed on this testing.
Data Sheet P12807EJ2V0DS00
7
PC2756TB
APPLICATION CIRCUIT EXAMPLE
(Top View) VT bias 15 k R1 1 000 pF L 5 nH 30 nH C2 3 LO1 HVU12 15 k R2 C3 1 000 pF LO2 4 3 300 pF C4 1 C1 RFin IFout 6 3 300 pF C5 3V
2 Signal Generator 1 000 pF 50
GND
VCC
5
50 Spectram Analyzer
ILLUSTRATION OF THE APPLICATION CIRCUIT ASSEMBLED ON EVALUATION BOARD
R1
C2
GND
C3
R2
VT
VCC
C4
RF input
C1
C5
IF output
COMPONENT LIST No. C1 to C3 C4, C5 R1, R2 L HVU12 Value 1 000 pF 3 300 pF 15 k 5 nH to 30 nH
Notes (1) 35 x 42 x 0.4 mm double copper clad polyimide board. (2) Back side: GND pattern (3) Solder plated on pattern (4) (5) : Through holes pattern should be removed on this testing.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
8
Data Sheet P12807EJ2V0DS00
PC2756TB
TYPICAL CHARACTERISTICS (TA = +25 C) - ON THE TEST CIRCUIT -
CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 No input signal
Circuit Current ICC (mA) Circuit Current ICC (mA)
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 10 No input signal VCC = 3.0 V 8
8
6
6
4
4
2
2 0 -40
0
1
2
3
4
5
6
-20
0
+20
+40
+60
+80
+100
Supply Voltage VCC (V)
Operating Ambient Temperature TA (C)
Conversion Gain CG (dB)
CONVERSION GAIN, SSB NOISE FIGURE vs. RF INPUT FREQUENCY 25 20
Single Side Band Noise Figure SSBNF (dB)
CONVERSION GAIN vs. IF OUTPUT FREQUENCY 30 25 20 15 10 5 0 VCC = 3.0 V PRFin = -55 dBm PL0in = -10 dBm fRF = 1.6 GHz IF coupling = 0.1 F
CG VCC = 3.0 V 20 15 PRFin = -55 dBm PL0in = -10 dBm 10 fIF = 150 MHz (Low-Side LO) 5 0.5
VCC = 3.3 V VCC = 2.7 V
15 10
NF
1.0
1.5
2.0
Conversion Gain CG (dB)
1
2
5
10
20
50
100
300
RF Input Frequency fRFin (GHz)
IF Output Frequency fIFout (MHz)
IF OUTPUT LEVEL, IM3 vs. RF INPUT LEVEL +10 0 -10 -20 -30 -40 -50 -60 -70 -80 -60 -40 -20 0 fRF1 = 900 MHz fRF2 = 905 MHz fLO = 800 MHz VCC = 3.0 V
IF Output Level PIFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) IF Output Level PIFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm)
IF OUTPUT LEVEL, IM3 vs. RF INPUT LEVEL +20 +10 0 -10 -20 -30 -40 -50 -60 -70 -80 -60 -40 -20 0 fRF1 = 2.0 GHz fRF2 = 2.005 GHz fLO = 1.9 GHz VCC = 3.0 V
+20
RF Input Level PRFin (dBm)
RF Input Level PRFin (dBm)
Data Sheet P12807EJ2V0DS00
9
PC2756TB
- ON THE APPLICATION CIRCUIT -
LO LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY 0 -10 -20 -30 -40 -50 -60 0.8
Local Leakage at IF Output Pin LOif (dBm)
VCC = 3.0 V PL0in = -10 dBm 1.0 1.2 1.4 1.6 Local Input Frequency fLO (GHz)
Local Leakage at RF Pin LOrf (dBm)
LO LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 0 VCC = 3.0 V PL0in = -10 dBm -10 -20 -30 -40 -50 -60 1.4
1.6
1.8
2.0
Local Input Frequency fLO (GHz)
10
Data Sheet P12807EJ2V0DS00
PC2756TB
VCO OSCILLATION FREQUENCY vs. TUNING VOLTAGE 2.5
VCO Oscillation Frequency fVCO (GHz)
L = 7 nH 2.0 L = 15 nH
1.5 L = 30 nH L = 50 nH 1.0
0.5 0 5 10 15 Tuning Voltage Vtu (V) 20 25
ATTEN 10 dB RL -40.0 dBm
VCO Phase Noise (fVCO = 774.425 8 MHz center) MKR -53.16 dB 10 dB / 10.0 kHz VCC = 3 V Vtune = 3 V TA = +25 C Monitor at pin 6
D
MKR 10.0 kHz -53.16 dB
K
CENTER 774.425 8 MHz RBW 1.0 kHz ++ VBW 100 Hz
SPAN 100.0 kHz SWP 3.0 s
ATTEN 10 dB RL -40.0 dBm
VCO Phase Noise (fVCO = 1.639 194 2 GHz center) MKR -40.34 dB 10 dB / 10.2 kHz VCC = 3 V Vtune = 3 V TA = +25 C Monitor at pin 6
D
MKR 10.2 kHz -40.34 dB
K
CENTER 1.639 194 2 GHz RBW 1.0 kHz ++ VBW 100 Hz
SPAN 100.0 kHz SWP 3.0 s
Data Sheet P12807EJ2V0DS00
11
PC2756TB
S-PARAMETOR
1
2 6 RF Port VCC = 3.0 V : 100 MHz : 500 MHz 900 MHz 3: 4 : 1 500 MHz 5 : 1 900 MHz 6 : 3 000 MHz
1 2
5 4
3
519.8 - j 1.1 59.3 - j 281.0 38.3 - j 157.0 31.5 - j 90.1 28.5 - j 67.9 25.7 - j 31.7
START STOP
0.100000000 GHz 3.100000000 GHz
5 2 1 3 4
IF Port VCC = 3.0 V : 50 MHz : 80 MHz 3 : 130 MHz 4 : 240 MHz 5 : 300 MHz
1 2
22.5 + j 6.1 24.2 + j 11.3 30.2 + j 16.6 42.6 + j 17.5 46.6 + j 15.6
START STOP
0.050000000 GHz 0.300000000 GHz
12
Data Sheet P12807EJ2V0DS00
PC2756TB
PACKAGE DIMENSIONS 6 pin super minimold (unit: mm)
0.2 +0.1 -0 0.15 +0.1 -0
0.1 MIN.
1.250.1
2.10.1
0 to 0.1
0.65 1.3
0.65 0.7 0.90.1
2.00.2
Data Sheet P12807EJ2V0DS00
13
PC2756TB
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as to minimize ground impedance (to prevent abnormal oscillation). (3) Keep the track length between the ground pins as short as possible. (4) Connect a bypass capacitor (example 1 000 pF) to the VCC pin. (5) To construct oscillator, tank circuit must be externally attached to pin 3 and 4.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
PC2756TB
Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 C or below Time: 30 seconds or less (at 210 C) Note Count: 3, Exposure limit : None Package peak temperature: 215 C or below Time: 40 seconds or less (at 200 C) Note Count: 3, Exposure limit : None Soldering bath temperature: 260 C or below Time: 10 seconds or less Note Count: 1, Exposure limit : None Pin temperature: 300 C Time: 3 seconds or less (per side of device) Note Exposure limit : None Recommended Condition Symbol IR35-00-3
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25 C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
14
Data Sheet P12807EJ2V0DS00
PC2756TB
[MEMO]
Data Sheet P12807EJ2V0DS00
15
PC2756TB
ATTENTION
OBSERVE PRECAUTIONS FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96. 5

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